Cooling with solid-state technology may hold the key to quicker AI laptops.
Memory bandwidth is transforming AI laptops, while traditional fan-based cooling is struggling to keep up.
Your next laptop's primary limitation might not be its processor; it could depend on its cooling efficiency. A new white paper from Ventiva, in collaboration with Moor Insights and Strategy, states that thermal design is becoming a crucial factor for the performance speed of AI laptops.
The real challenge lies in memory bandwidth.
The paper outlines that local AI performance is quantified in tokens per second, predominantly determined by memory bandwidth. Currently, most laptops continue to utilize 128-bit memory buses coupled with LPDDR5 memory, which limits bandwidth to about 150 GB per second. This speed is insufficient for operating today’s more complex AI models at practical speeds, prompting chip manufacturers to address the issue.
Qualcomm has advanced its Snapdragon X2 Elite chips to 192-bit buses, while AMD and NVIDIA now provide 256-bit options in their client silicon. Apple has made the most significant stride with its M5 Max, featuring an impressive 512-bit bus capable of running comprehensive open source models like GPT-OSS 120 B entirely on the device. The report anticipates that the trend towards wider buses will intensify with the introduction of LPDDR6 memory, promising enhanced data rates and improved efficiency, with mainstream use expected by 2027 and 2028.
However, there’s a complication. Wider memory buses necessitate memory chips to be situated very close to the processor, within traces shorter than 25 millimeters—precisely the area where fans and heat pipes have typically been located in thin and lightweight laptops. Apple overcomes this by integrating memory directly onto its chip package, yet other laptop manufacturers face the same spatial challenge within a conventional chassis.
The limitations of fan cooling systems.
Traditional fan-based cooling solutions are unable to evolve alongside these more compact memory configurations, especially as chipmakers move towards 256-bit and wider buses. This scenario is bringing solid-state cooling to the forefront as a viable alternative. The report points out Ventiva’s ionic cooling platform, which utilizes charged particles to silently circulate air without any mechanical components.
Additionally, it cites Frore’s AirJet technology, which has recently demonstrated its effectiveness by cooling an Intel reference laptop that measures just 11.3mm in thickness, managing 15 watts of fanless cooling while remaining silent. Meanwhile, YPlasma unveiled a plasma-powered laptop cooler at CES, utilizing ionized gas instead of a rotating fan to circulate air, with a claimed operational noise level of just 17 decibels.
The paper suggests that 2027 and 2028 will mark a significant turning point when wider memory buses and LPDDR6 will become standard. If this timeline is accurate, laptop manufacturers will need to reevaluate their approach to cooling rather than treating it as an afterthought.
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Cooling with solid-state technology may hold the key to quicker AI laptops.
Memory bandwidth, rather than processing power, is increasingly the primary limitation for AI laptops. A recent white paper examines the reasons why fan-based cooling is inadequate and how solid-state cooling might take its place.
