A recent leak indicates that Qualcomm's upcoming chip may enhance the performance of your Windows device.

      Nadeem Sarwar / Digital Trends

      Qualcomm is reportedly working on its upcoming high-end processor for Windows PCs, the Snapdragon X2. This new chip is expected to significantly increase the core count, featuring as many as 18 Oryon V3 cores. According to information from WinFuture, the Snapdragon X2, with the model number SC8480XP, is likely to employ a system-in-package (SiP) design, which integrates both RAM and flash storage directly within the processor package. Leaked import-export documents indicate that configurations may include up to 48GB of SK hynix RAM and a 1TB SSD. This integration is designed to improve data transfer speeds and enhance energy efficiency by minimizing latency between components.

      Details about the core architecture and clock speeds of the Snapdragon X2 are still unknown, and it remains uncertain whether it will feature solely high-performance cores or a variety of core types. However, documentation suggests it is a “high-TDP” version, likely representing the most potent iteration.

      To handle the increased performance demands and potential heat output, Qualcomm is reportedly testing the Snapdragon X2 with an all-in-one liquid cooler that includes a 120mm radiator. This highlights the company's emphasis on maintaining optimal thermal performance, particularly in desktop settings where higher power consumption is permissible.

      The Snapdragon X2 is expected to be marketed under the “Snapdragon X2 Ultra Premium” designation, aimed at high-end laptops and desktops. This development fits into Qualcomm’s strategy to better compete against established x86 architecture processors from Intel and AMD, as well as ARM-based solutions such as Apple's M-series chips.

      This isn't the first time Qualcomm's future plans for the Snapdragon X platform have come to light. In November, Qualcomm confirmed that its forthcoming PC processor, the Snapdragon X Elite Gen 2, will feature the Oryon v3 CPU. This announcement came just a month after the unveiling of the Oryon v2, which is slated for inclusion in the Snapdragon 8 Elite chipset for smartphones. The Oryon v2 is reported to offer a 30% performance increase and 57% greater power efficiency compared to its predecessor. It is hoped that the v3 will exceed these advancements.

      The release of the Snapdragon X2 could have a notable effect on the Windows on ARM ecosystem, delivering enhanced performance and efficiency for users. Nevertheless, challenges such as software compatibility and market acceptance persist, as previous ARM-based Windows devices have struggled with certain applications and games. At this point, Qualcomm has not officially confirmed these details, and the information is based on leaked documents. More definitive information may be revealed at upcoming industry events, possibly during Mobile World Congress (MWC), which begins today.

      Kunal Khullar is a computing writer at Digital Trends, contributing to a variety of topics, including CPUs, GPUs, monitors, and more.

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